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****************************************************************************** * @file readme.txt * @author MCD Application Team * @version 1.0 * @date 17-January-2019 * @brief 32MP157DISCOVERY SCHEMATICS files package ****************************************************************************** * COPYRIGHT(c) 2017 STMicroelectronics * * The Open Platform License Agreement (“Agreement”) is a binding legal contract * between you ("You") and STMicroelectronics International N.V. (“ST”), a * company incorporated under the laws of the Netherlands acting for the purpose * of this Agreement through its Swiss branch 39, Chemin du Champ des Filles, * 1228 Plan-les-Ouates, Geneva, Switzerland. * * By using the enclosed reference designs, schematics, PC board layouts, and * documentation, in hardcopy or CAD tool file format (collectively, the * “Reference Material”), You are agreeing to be bound by the terms and * conditions of this Agreement. Do not use the Reference Material until You * have read and agreed to this Agreement terms and conditions. The use of * the Reference Material automatically implies the acceptance of the Agreement * terms and conditions. * * The complete Open Platform License Agreement can be found on www.st.com/opla. ****************************************************************************** ======================== * History ======================== * 1.0 - 17-January-2019 ------------------------ + First official release. ******************* (C) COPYRIGHT 2018 STMicroelectronics *****END OF FILE
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