This project was conducted as part of the laboratory work for the course "Microelectronics and Packaging Techniques" in ece NTUA. The project aimed to design an amplifier circuit using the LM308N integrated circuit.
The chosen circuit configuration is an inverting amplifier with high input resistance.
Image 1: Circuit
- Eagle: The initial circuit design was done using the Eagle software.
- Fusion 360: The board layout was designed in Fusion 360 to visualize the 3D model.
- SimScale: Thermal analysis of the board was performed using SimScale.
- Amplifier: LM308N
- Resistors: R-EU0207/10 series
- Capacitor: CPOL-EUE1.8-4
The team used Eagle for the schematic design, and the board layout was created with tools like Polygon, Ratsnest, and Route airway.
Image 3: Circuit in Eagle
The board was modeled in 3D using Autodesk Fusion 360, providing a comprehensive view from different angles.
Image 5: 3D Model in Fusion 360
To enhance thermal performance, heatsinks were added to the LM308N. Various heatsinks were experimented with, and the best results were obtained with heatsink hs7.
Image 6: Heatsink on LM308N
The thermal analysis was performed using SimScale, with results shown below.
Image 7: Thermal Analysis Results
The thermal analysis revealed that while heatsinks significantly reduced the temperature of the integrated circuit, achieving the optimal operating temperature range specified in the LM308N datasheet was challenging. Despite this, the heatsink demonstrated efficiency in cooling a portion of the IC.
Note: Detailed dimensions, resistor values, and other specifics are available in the full report.