forked from ujdcodr/NewHotSpot
-
Notifications
You must be signed in to change notification settings - Fork 0
/
hotspot.config
165 lines (148 loc) · 4.41 KB
/
hotspot.config
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
145
146
147
148
149
150
151
152
153
154
155
156
157
158
159
160
161
162
163
164
165
# thermal model parameters
# chip specs 354.95
# chip thickness in meters
-t_chip 0.00015
# silicon thermal conductivity in W/(m-K)
-k_chip 100.0
# silicon specific heat in J/(m^3-K)
-p_chip 1.75e6
# temperature threshold for DTM (kelvin)
-thermal_threshold 354.95
# heat sink specs
# convection capacitance in J/K
-c_convec 140.4
# convection resistance in K/W
-r_convec 0.01 #0.1
# heatsink side in meters
-s_sink 0.05
# heatsink thickness in meters
-t_sink 0.001
# heatsink thermal conductivity in W/(m-K)
-k_sink 400.0
# heatsink specific heat in J/(m^3-K)
-p_sink 3.55e6
# heat spreader specs
# spreader side in meters
-s_spreader 0.05
# spreader thickness in meters
-t_spreader 0.001
# heat spreader thermal conductivity in W/(m-K)
-k_spreader 400.0
# heat spreader specific heat in J/(m^3-K)
-p_spreader 3.55e6
# interface material specs
# interface material thickness in meters
-t_interface 2.0e-05
# interface material thermal conductivity in W/(m-K)
-k_interface 4.0
# interface material specific heat in J/(m^3-K)
-p_interface 4.0e6
# secondary path (C4/underfill, package substrate, solder balls etc)
# ONLY AVAILABLE IN THE GRID MODEL
# model secondary path or not?
-model_secondary 0
# convection resistance at the air/PCB interface in K/W
-r_convec_sec 50.0
# convection capacitance at the air/PCB interface in J/K
-c_convec_sec 40.0
# number of on-chip metal layers
-n_metal 8
# one metal layer thickness in meters
-t_metal 100.0e-6
# C4/underfill thickness in meters
-t_c4 0.0001
# side size of EACH C4 pad
-s_c4 20.0e-6
# number of C4 pads
-n_c4 400
# package substrate side in meters
-s_sub 0.021
# package substrate thickness in meters
-t_sub 0.001
# solder ball side in meters
-s_solder 0.021
# solder ball thickness in meters
-t_solder 0.00094
# PCB side in meters
-s_pcb 0.1
# PCB thickness in meters
-t_pcb 0.002
# others
# ambient temperature in kelvin
-ambient 318.15
# initial temperatures from file
-init_file (null)
# initial temperature (kelvin) if not from file
-init_temp 318.15
# steady state temperatures to file
-steady_file (null)
# hotspot calling interval - 100K cycles at 2.5GHz
-sampling_intvl 4e-05
# base processor frequency in Hz
-base_proc_freq 2.5e+09
# is DTM employed?
-dtm_used 0
# model type - block or grid
-model_type block
# consider temperature-leakage loop within HotSpot?
-leakage_used 0
# leakage calculation modes: (only valid when -leakage_used=1)
# 0 user-defined leakage power model, do temp-leakage loop within HotSpot
# 1 use HotLeakage -- !NOT implemented in this release!, coming later.
-leakage_mode 0
# use detailed package model?
-package_model_used 0
-package_config_file package.config
# block model specific parameters
# omit lateral chip resistances?
-block_omit_lateral 0
# grid model specific parameters
# grid resolution - no. of rows
-grid_rows 64
# grid resolution - no. of cols
-grid_cols 64
# layer configuration from file
-grid_layer_file (null)
# dump internal grid steady state temperatures
-grid_steady_file (null)
# grid to block mapping mode - (avg|min|max|center)
# i.e., a block's temperature is the avg, min or max
# of all the grid cells in it or equal to that of
# the grid cell in its center
-grid_map_mode center
# floorplanner parameters
# L2 modeling
# wrap around L2?
-wrap_l2 1
# name of the L2 unit to look for
-l2_label L2
# rim modeling
# model dead space around the rim of the chip?
-model_rim 0
# thickness of the rim in meters
-rim_thickness 5e-05
# others
# area ratio below which to ignore dead space
-compact_ratio 0.005
# no. of discrete orientations for a shape curve (even no. > 1)
-n_orients 300
# annealing parameters
# initial acceptance probability
-P0 0.99
# average change (delta) in cost
-Davg 1
# no. of moves to try in each step
-Kmoves 7
# ratio for the cooling schedule
-Rcool 0.99
# ratio of rejects at which to stop annealing
-Rreject 0.99
# absolute max no. of annealing steps
-Nmax 1000
# weights for the metric: lambdaA * A + lambdaT * T + lambdaW * W
# weight for the area term
-lambdaA 5.0e+06
# weight for the temperature term
-lambdaT 1
# weight for the wire length term
-lambdaW 350