This repository contains TI's SimpleLink Low Power F2 (previously CC13XX/CC26XX) Software Development Kit (SDK).
The SimpleLink™ Low Power F2 Software Development Kit (previously SimpleLink™ CC13xx and CC26xx SDK) provides a comprehensive software package for the development of Sub-1 GHz and 2.4 GHz applications, including support for Bluetooth® Low Energy, Mesh, Zigbee®, Matter, Thread, 802.15.4-based, proprietary, and multiprotocol solutions on the SimpleLink CC13x1, CC13x2, CC13x4, CC26x1, CC26x2, and CC26x4 wireless MCUs.
An overview of the full SDK is hosted on TI Resource Explorer.
This repository contains a subset of TI's SimpleLink CC13XX/CC26XX SDK. It is provided via a Git repo to meet several use cases, including:
- Reduces download size
- Enables CI/CD tooling to use Git rather than installers
- Increases visibility of changes, better enabling benefit/risk assessments
- Simplifies the workflow for rebasing user changes to different releases
It intentionally omits documentation (the docs/ directory) and examples (examples/) to reduce size. Regarding those omissions:
- Documentation is available online. Please match your git version to the documentation version in the TI Developer Zone.
- Examples are available in separate repositories, as noted in Examples.
- Supports proprietary Sub-1 GHz and 2.4 GHz applications using basic RX and TX examples
- TI 15.4-Stack, an IEEE 802.15.4-based star topology networking solution for the Sub-1 GHz and 2.4 GHz bands
- Certified Wi-SUN® FAN 1.0 compliant Sub-1 GHz mesh stack (learn more at TI.com/wisun)
- Bluetooth Low Energy (BLE) software protocol stack supporting Bluetooth 5.2 and Bluetooth mesh (learn more at TI.com/ble)
- Matter 1.0 and Thread 1.3 networking protocol based on open-source Matter project and OpenThread (learn more at TI.com/matter or in the TI Matter Repo)
- Zigbee software protocol stack (Z-stack - learn more at TI.com/Zigbee)
- Supports the concurrent operation of BLE + Sub-1 GHz (TI 15.4-Stack or proprietary Sub-1 GHz) and BLE + Zigbee using the Dynamic Multi-Protocol
- Supports Amazon Sidewalk Sub-1 GHz FSK and Bluetooth Low Energy
The imports.mak file, located at the root of the SDK, is a generic sample and will not work out of the box. Please update imports.mak with the tools (compilers, cmake, etc.) paths installed on your system.
For a Linux build, settings must be updated to match your build system's setup. The only outlier may be Python, as most python3.6+ interpreters will work. Please note cmake must be 3.21+, or the builds will fail. If using CCS ccs1220, the SysConfig installed is incompatible with the SDKs. Either upgrade to a CCS version with SysConfig 1.16.2 (ccs1230+) or install SysConfig 1.16.2 from https://www.ti.com/tool/SYSCONFIG. Please note XDC_INSTALL_DIR was required in older SDKs but is no longer needed.
By default TICLANG and GCC toolchains are enabled. If a toolchain is not needed, unset the compiler, for example, GCC_ARMCOMPILER ?=.
XDC_INSTALL_DIR ?= /home/username/ti/xdctools_3_62_01_15_core (Not required for 7.10+ SDK's)
SYSCONFIG_TOOL ?= /home/username/ti/ccs1230/ccs/utils/sysconfig_1.16.2/sysconfig_cli.sh
FREERTOS_INSTALL_DIR ?= /home/username/FreeRTOSv202104.00
CMAKE ?= /home/username/cmake-3.21.3/bin/cmake
PYTHON ?= python3
TICLANG_ARMCOMPILER ?= /home/username/ti/ccs1230/ccs/tools/compiler/ti-cgt-armllvm_2.1.3.LTS-0
GCC_ARMCOMPILER ?= /home/username/ti/ccs1230/ccs/tools/compiler/9.2019.q4.major-0
Edit imports.mak and update all of the above tool location variables to reflect the paths on your build system.
SDK libraries must exist before building any examples. After editing imports.mak, build SDK libraries from the root of the SDK (the same directory where imports.mak resides) by:
$ make
The make will go through the SDK and build all libraries. Depending on the build machine, the make will run for a few minutes.
All devices supported by the SimpleLink Low Power F2 SDK.
For licensing information, please refer to licensing.
Please consider creating a post on TI's E2E forum. Additionally, we welcome any feedback.