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Merge pull request #1910 from poeschlr/reexport_lga
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Fix EP radius and resync of LGA footprints
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evanshultz authored Jan 8, 2020
2 parents 4bb0492 + 66c4783 commit 969ff5f
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Showing 12 changed files with 57 additions and 57 deletions.
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@@ -1,4 +1,4 @@
(module Bosch_LGA-8_3x3mm_P0.8mm_ClockwisePinNumbering (layer F.Cu) (tedit 5CF93F4A)
(module Bosch_LGA-8_3x3mm_P0.8mm_ClockwisePinNumbering (layer F.Cu) (tedit 5D9F7937)
(descr "Bosch LGA, 8 Pin (https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BME680-DS001-00.pdf#page=44), generated with kicad-footprint-generator ipc_noLead_generator.py")
(tags "Bosch LGA NoLead")
(attr smd)
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Original file line number Diff line number Diff line change
@@ -1,4 +1,4 @@
(module LGA-14_2x2mm_P0.35mm_LayoutBorder3x4y (layer F.Cu) (tedit 5CF93F4A)
(module LGA-14_2x2mm_P0.35mm_LayoutBorder3x4y (layer F.Cu) (tedit 5D9F7937)
(descr "LGA, 14 Pin (http://www.st.com/resource/en/datasheet/lis2dh.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py")
(tags "LGA NoLead")
(attr smd)
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Original file line number Diff line number Diff line change
@@ -1,4 +1,4 @@
(module LGA-14_3x2.5mm_P0.5mm_LayoutBorder3x4y (layer F.Cu) (tedit 5CF93F4A)
(module LGA-14_3x2.5mm_P0.5mm_LayoutBorder3x4y (layer F.Cu) (tedit 5D9F7937)
(descr "LGA, 14 Pin (http://www.st.com/resource/en/datasheet/lsm6ds3.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py")
(tags "LGA NoLead")
(attr smd)
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Original file line number Diff line number Diff line change
@@ -1,4 +1,4 @@
(module LGA-14_3x5mm_P0.8mm_LayoutBorder1x6y (layer F.Cu) (tedit 5CF93F4A)
(module LGA-14_3x5mm_P0.8mm_LayoutBorder1x6y (layer F.Cu) (tedit 5D9F7937)
(descr "LGA, 14 Pin (http://www.st.com/resource/en/datasheet/lsm303dlhc.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py")
(tags "LGA NoLead")
(attr smd)
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Original file line number Diff line number Diff line change
@@ -1,4 +1,4 @@
(module LGA-16_3x3mm_P0.5mm_LayoutBorder3x5y (layer F.Cu) (tedit 5CF93F4A)
(module LGA-16_3x3mm_P0.5mm_LayoutBorder3x5y (layer F.Cu) (tedit 5D9F7937)
(descr "LGA, 16 Pin (http://www.st.com/resource/en/datasheet/lis331hh.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py")
(tags "LGA NoLead")
(attr smd)
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Original file line number Diff line number Diff line change
@@ -1,4 +1,4 @@
(module LGA-16_4x4mm_P0.65mm_LayoutBorder4x4y (layer F.Cu) (tedit 5CF93F4A)
(module LGA-16_4x4mm_P0.65mm_LayoutBorder4x4y (layer F.Cu) (tedit 5D9F7937)
(descr "LGA, 16 Pin (http://www.st.com/resource/en/datasheet/l3gd20.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py")
(tags "LGA NoLead")
(attr smd)
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Original file line number Diff line number Diff line change
@@ -1,4 +1,4 @@
(module NXP_LGA-8_3x5mm_P1.25mm_H1.1mm (layer F.Cu) (tedit 5CF4DD2A)
(module NXP_LGA-8_3x5mm_P1.25mm_H1.1mm (layer F.Cu) (tedit 5D9F7937)
(descr "NXP LGA, 8 Pin (https://www.nxp.com/docs/en/data-sheet/MPL3115A2.pdf#page=42), generated with kicad-footprint-generator ipc_noLead_generator.py")
(tags "NXP LGA NoLead")
(attr smd)
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4 changes: 2 additions & 2 deletions Package_LGA.pretty/NXP_LGA-8_3x5mm_P1.25mm_H1.2mm.kicad_mod
Original file line number Diff line number Diff line change
@@ -1,5 +1,5 @@
(module NXP_LGA-8_3x5mm_P1.25mm_H1.2mm (layer F.Cu) (tedit 5CC9CA8E)
(descr "NXP LGA, 8 Pin (https://www.nxp.com/docs/en/data-sheet/MPL115A1.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py")
(module NXP_LGA-8_3x5mm_P1.25mm_H1.2mm (layer F.Cu) (tedit 5D9F7937)
(descr "NXP LGA, 8 Pin (https://www.nxp.com/docs/en/data-sheet/MPL115A1.pdf#page=15), generated with kicad-footprint-generator ipc_noLead_generator.py")
(tags "NXP LGA NoLead")
(attr smd)
(fp_text reference REF** (at 0 -3.45) (layer F.SilkS)
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Original file line number Diff line number Diff line change
@@ -1,4 +1,4 @@
(module ST_HLGA-10_2.5x2.5mm_P0.6mm_LayoutBorder3x2y (layer F.Cu) (tedit 5CF93F4A)
(module ST_HLGA-10_2.5x2.5mm_P0.6mm_LayoutBorder3x2y (layer F.Cu) (tedit 5D9F7937)
(descr "ST HLGA, 10 Pin (https://www.st.com/resource/en/datasheet/lps25hb.pdf#page=46), generated with kicad-footprint-generator ipc_noLead_generator.py")
(tags "ST HLGA NoLead")
(attr smd)
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Original file line number Diff line number Diff line change
@@ -1,4 +1,4 @@
(module Texas_SIL0008D_MicroSiP-8-1EP_2.8x3mm_P0.65mm_EP1.1x1.9mm (layer F.Cu) (tedit 5CF944E9)
(module Texas_SIL0008D_MicroSiP-8-1EP_2.8x3mm_P0.65mm_EP1.1x1.9mm (layer F.Cu) (tedit 5DC5FD10)
(descr "Texas SIL0008D MicroSiP, 8 Pin (http://www.ti.com/lit/ds/symlink/tps82130.pdf#page=19), generated with kicad-footprint-generator ipc_noLead_generator.py")
(tags "Texas MicroSiP NoLead")
(attr smd)
Expand All @@ -19,10 +19,6 @@
(fp_line (start -1.65 1.75) (end 1.65 1.75) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.65 1.75) (end 1.65 -1.75) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.65 -1.75) (end -1.65 -1.75) (layer F.CrtYd) (width 0.05))
(pad 9 smd roundrect (at 0 0) (size 1.1 1.9) (layers F.Cu F.Mask) (roundrect_rratio 0.227273))
(pad "" smd roundrect (at 0 -0.63) (size 0.89 0.51) (layers F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at 0 0) (size 0.89 0.51) (layers F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at 0 0.63) (size 0.89 0.51) (layers F.Paste) (roundrect_rratio 0.25))
(pad 1 smd roundrect (at -1.0625 -0.975) (size 0.625 0.5) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 2 smd roundrect (at -1.0625 -0.325) (size 0.625 0.5) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 3 smd roundrect (at -1.0625 0.325) (size 0.625 0.5) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
Expand All @@ -31,6 +27,10 @@
(pad 6 smd roundrect (at 1.0625 0.325) (size 0.625 0.5) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 7 smd roundrect (at 1.0625 -0.325) (size 0.625 0.5) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 8 smd roundrect (at 1.0625 -0.975) (size 0.625 0.5) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 9 smd rect (at 0 0) (size 1.1 1.9) (layers F.Cu F.Mask))
(pad "" smd roundrect (at 0 -0.63) (size 0.89 0.51) (layers F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at 0 0) (size 0.89 0.51) (layers F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at 0 0.63) (size 0.89 0.51) (layers F.Paste) (roundrect_rratio 0.25))
(fp_text user %R (at 0 0) (layer F.Fab)
(effects (font (size 0.7 0.7) (thickness 0.1)))
)
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Original file line number Diff line number Diff line change
@@ -1,4 +1,4 @@
(module Texas_SIL0008D_MicroSiP-8-1EP_2.8x3mm_P0.65mm_EP1.1x1.9mm_ThermalVias (layer F.Cu) (tedit 5CF944E9)
(module Texas_SIL0008D_MicroSiP-8-1EP_2.8x3mm_P0.65mm_EP1.1x1.9mm_ThermalVias (layer F.Cu) (tedit 5DC5FD10)
(descr "Texas SIL0008D MicroSiP, 8 Pin (http://www.ti.com/lit/ds/symlink/tps82130.pdf#page=19), generated with kicad-footprint-generator ipc_noLead_generator.py")
(tags "Texas MicroSiP NoLead")
(attr smd)
Expand All @@ -19,14 +19,6 @@
(fp_line (start -1.65 1.75) (end 1.65 1.75) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.65 1.75) (end 1.65 -1.75) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.65 -1.75) (end -1.65 -1.75) (layer F.CrtYd) (width 0.05))
(pad 9 smd roundrect (at 0 0) (size 1.1 1.9) (layers F.Cu F.Mask) (roundrect_rratio 0.227273))
(pad 9 thru_hole circle (at 0 -0.75) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 9 thru_hole circle (at 0 0) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 9 thru_hole circle (at 0 0.75) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 9 smd roundrect (at 0 0) (size 0.5 2) (layers B.Cu) (roundrect_rratio 0.25))
(pad "" smd roundrect (at 0 -0.63) (size 0.95 0.55) (layers F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at 0 0) (size 0.95 0.55) (layers F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at 0 0.63) (size 0.95 0.55) (layers F.Paste) (roundrect_rratio 0.25))
(pad 1 smd roundrect (at -1.0625 -0.975) (size 0.625 0.5) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 2 smd roundrect (at -1.0625 -0.325) (size 0.625 0.5) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 3 smd roundrect (at -1.0625 0.325) (size 0.625 0.5) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
Expand All @@ -35,6 +27,14 @@
(pad 6 smd roundrect (at 1.0625 0.325) (size 0.625 0.5) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 7 smd roundrect (at 1.0625 -0.325) (size 0.625 0.5) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 8 smd roundrect (at 1.0625 -0.975) (size 0.625 0.5) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 9 smd rect (at 0 0) (size 1.1 1.9) (layers F.Cu F.Mask))
(pad 9 thru_hole circle (at 0 -0.75) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 9 thru_hole circle (at 0 0) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 9 thru_hole circle (at 0 0.75) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 9 smd rect (at 0 0) (size 0.5 2) (layers B.Cu))
(pad "" smd roundrect (at 0 -0.63) (size 0.95 0.55) (layers F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at 0 0) (size 0.95 0.55) (layers F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at 0 0.63) (size 0.95 0.55) (layers F.Paste) (roundrect_rratio 0.25))
(fp_text user %R (at 0 0) (layer F.Fab)
(effects (font (size 0.7 0.7) (thickness 0.1)))
)
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Original file line number Diff line number Diff line change
@@ -1,48 +1,48 @@
(module Texas_SIL0010A_MicroSiP-10-1EP_3.8x3mm_P0.6mm_EP0.7x2.9mm_ThermalVias (layer F.Cu) (tedit 5BA3897C)
(descr "Texas SIL0010A MicroSiP, 10 Pin (http://www.ti.com/lit/ml/mpds579b/mpds579b.pdf), generated with kicad-footprint-generator ipc_lga_layoutBorder_generator.py")
(tags "Texas MicroSiP LGA")
(module Texas_SIL0010A_MicroSiP-10-1EP_3.8x3mm_P0.6mm_EP0.7x2.9mm_ThermalVias (layer F.Cu) (tedit 5DC5FD10)
(descr "Texas SIL0010A MicroSiP, 10 Pin (http://www.ti.com/lit/ml/mpds579b/mpds579b.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py")
(tags "Texas MicroSiP NoLead")
(attr smd)
(fp_text reference REF** (at 0 -2.45) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value Texas_SIL0010A_MicroSiP-10-1EP_3.8x3mm_P0.6mm_EP0.7x2.9mm_ThermalVias (at 0 2.45) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start 0 -1.61) (end 1.9 -1.61) (layer F.SilkS) (width 0.12))
(fp_line (start -1.9 1.61) (end 1.9 1.61) (layer F.SilkS) (width 0.12))
(fp_line (start -1.15 -1.5) (end 1.9 -1.5) (layer F.Fab) (width 0.1))
(fp_line (start 1.9 -1.5) (end 1.9 1.5) (layer F.Fab) (width 0.1))
(fp_line (start 1.9 1.5) (end -1.9 1.5) (layer F.Fab) (width 0.1))
(fp_line (start -1.9 1.5) (end -1.9 -0.75) (layer F.Fab) (width 0.1))
(fp_line (start -1.9 -0.75) (end -1.15 -1.5) (layer F.Fab) (width 0.1))
(fp_line (start -2.17 -1.75) (end -2.17 1.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.17 1.75) (end 2.17 1.75) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.17 1.75) (end 2.17 -1.75) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.17 -1.75) (end -2.17 -1.75) (layer F.CrtYd) (width 0.05))
(pad 1 smd roundrect (at -1.525 -1.2) (size 0.8 0.45) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 2 smd roundrect (at -1.525 -0.6) (size 0.8 0.45) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 3 smd roundrect (at -1.525 0) (size 0.8 0.45) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 4 smd roundrect (at -1.525 0.6) (size 0.8 0.45) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 5 smd roundrect (at -1.525 1.2) (size 0.8 0.45) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 6 smd roundrect (at 1.525 1.2) (size 0.8 0.45) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 7 smd roundrect (at 1.525 0.6) (size 0.8 0.45) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 8 smd roundrect (at 1.525 0) (size 0.8 0.45) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 9 smd roundrect (at 1.525 -0.6) (size 0.8 0.45) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 10 smd roundrect (at 1.525 -1.2) (size 0.8 0.45) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 11 smd rect (at -0.175 0) (size 0.7 2.9) (layers F.Cu F.Mask))
(pad 11 thru_hole circle (at -0.175 -1.03) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 11 thru_hole circle (at -0.175 0) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 11 thru_hole circle (at -0.175 1.03) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 11 smd rect (at -0.175 0) (size 0.5 2.56) (layers B.Cu))
(pad "" smd roundrect (at -0.175 -0.97) (size 0.65 0.9) (layers F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at -0.175 0) (size 0.65 0.9) (layers F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at -0.175 0.97) (size 0.65 0.9) (layers F.Paste) (roundrect_rratio 0.25))
(fp_text user %R (at 0 0) (layer F.Fab)
(effects (font (size 0.95 0.95) (thickness 0.14)))
)
(fp_line (start 2.15 -1.75) (end -2.15 -1.75) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.15 1.75) (end 2.15 -1.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.15 1.75) (end 2.15 1.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.15 -1.75) (end -2.15 1.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.9 -0.75) (end -1.15 -1.5) (layer F.Fab) (width 0.1))
(fp_line (start -1.9 1.5) (end -1.9 -0.75) (layer F.Fab) (width 0.1))
(fp_line (start 1.9 1.5) (end -1.9 1.5) (layer F.Fab) (width 0.1))
(fp_line (start 1.9 -1.5) (end 1.9 1.5) (layer F.Fab) (width 0.1))
(fp_line (start -1.15 -1.5) (end 1.9 -1.5) (layer F.Fab) (width 0.1))
(fp_line (start -1.9 1.61) (end 1.9 1.61) (layer F.SilkS) (width 0.12))
(fp_line (start 0 -1.61) (end 1.9 -1.61) (layer F.SilkS) (width 0.12))
(pad 10 smd roundrect (at 1.525 -1.2) (size 0.8 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 9 smd roundrect (at 1.525 -0.6) (size 0.8 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 8 smd roundrect (at 1.525 0) (size 0.8 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 7 smd roundrect (at 1.525 0.6) (size 0.8 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 6 smd roundrect (at 1.525 1.2) (size 0.8 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 5 smd roundrect (at -1.525 1.2) (size 0.8 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 4 smd roundrect (at -1.525 0.6) (size 0.8 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 3 smd roundrect (at -1.525 0) (size 0.8 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 2 smd roundrect (at -1.525 -0.6) (size 0.8 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 1 smd roundrect (at -1.525 -1.2) (size 0.8 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad "" smd roundrect (at -0.175 0.97) (size 0.65 0.9) (layers F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at -0.175 0) (size 0.65 0.9) (layers F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at -0.175 -0.97) (size 0.65 0.9) (layers F.Paste) (roundrect_rratio 0.25))
(pad 11 smd roundrect (at -0.175 0) (size 0.5 2.56) (layers B.Cu) (roundrect_rratio 0.25))
(pad 11 thru_hole circle (at -0.175 1.03) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 11 thru_hole circle (at -0.175 0) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 11 thru_hole circle (at -0.175 -1.03) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 11 smd roundrect (at -0.175 0) (size 0.7 2.9) (layers F.Cu F.Mask) (roundrect_rratio 0.25))
(model ${KISYS3DMOD}/Package_LGA.3dshapes/Texas_SIL0010A_MicroSiP-10-1EP_3.8x3mm_P0.6mm_EP0.7x2.9mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
)

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