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EP now no longer uses rounded corners for copper
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@poeschlr
poeschlr committed Nov 8, 2019
1 parent 893526f commit 1aa06c9
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Showing 47 changed files with 154 additions and 154 deletions.
4 changes: 2 additions & 2 deletions Package_SO.pretty/HSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.1mm.kicad_mod
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(module HSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.1mm (layer F.Cu) (tedit 5D9F72AF)
(module HSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.1mm (layer F.Cu) (tedit 5DC5FE74)
(descr "HSOP, 8 Pin (https://www.st.com/resource/en/datasheet/l5973d.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py")
(tags "HSOP SO")
(attr smd)
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(pad 6 smd roundrect (at 2.65 0.635) (size 1.6 0.6) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 7 smd roundrect (at 2.65 -0.635) (size 1.6 0.6) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 8 smd roundrect (at 2.65 -1.905) (size 1.6 0.6) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 9 smd roundrect (at 0 0) (size 2.41 3.1) (layers F.Cu F.Mask) (roundrect_rratio 0.062241))
(pad 9 smd rect (at 0 0) (size 2.41 3.1) (layers F.Cu F.Mask))
(pad "" smd roundrect (at -0.6 -0.775) (size 0.97 1.25) (layers F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at -0.6 0.775) (size 0.97 1.25) (layers F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at 0.6 -0.775) (size 0.97 1.25) (layers F.Paste) (roundrect_rratio 0.25))
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6 changes: 3 additions & 3 deletions Package_SO.pretty/HSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.1mm_ThermalVias.kicad_mod
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@@ -1,4 +1,4 @@
(module HSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.1mm_ThermalVias (layer F.Cu) (tedit 5D9F72AF)
(module HSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.1mm_ThermalVias (layer F.Cu) (tedit 5DC5FE74)
(descr "HSOP, 8 Pin (https://www.st.com/resource/en/datasheet/l5973d.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py")
(tags "HSOP SO")
(attr smd)
Expand Down Expand Up @@ -29,14 +29,14 @@
(pad 6 smd roundrect (at 2.65 0.635) (size 1.6 0.6) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 7 smd roundrect (at 2.65 -0.635) (size 1.6 0.6) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 8 smd roundrect (at 2.65 -1.905) (size 1.6 0.6) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 9 smd roundrect (at 0 0) (size 2.41 3.1) (layers F.Cu F.Mask) (roundrect_rratio 0.062241))
(pad 9 smd rect (at 0 0) (size 2.41 3.1) (layers F.Cu F.Mask))
(pad 9 thru_hole circle (at -0.955 -1.3) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 9 thru_hole circle (at 0.955 -1.3) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 9 thru_hole circle (at -0.955 0) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 9 thru_hole circle (at 0.955 0) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 9 thru_hole circle (at -0.955 1.3) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 9 thru_hole circle (at 0.955 1.3) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 9 smd roundrect (at 0 0) (size 2.41 3.1) (layers B.Cu) (roundrect_rratio 0.062241))
(pad 9 smd rect (at 0 0) (size 2.41 3.1) (layers B.Cu))
(pad "" smd roundrect (at -0.6 -0.775) (size 0.97 1.25) (layers F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at -0.6 0.775) (size 0.97 1.25) (layers F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at 0.6 -0.775) (size 0.97 1.25) (layers F.Paste) (roundrect_rratio 0.25))
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4 changes: 2 additions & 2 deletions Package_SO.pretty/HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.4x3.2mm.kicad_mod
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@@ -1,4 +1,4 @@
(module HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.4x3.2mm (layer F.Cu) (tedit 5D9F72AF)
(module HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.4x3.2mm (layer F.Cu) (tedit 5DC5FE74)
(descr "HTSOP, 8 Pin (https://media.digikey.com/pdf/Data%20Sheets/Rohm%20PDFs/BD9G341EFJ.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py")
(tags "HTSOP SO")
(attr smd)
Expand Down Expand Up @@ -29,7 +29,7 @@
(pad 6 smd roundrect (at 2.65 0.635) (size 1.6 0.6) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 7 smd roundrect (at 2.65 -0.635) (size 1.6 0.6) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 8 smd roundrect (at 2.65 -1.905) (size 1.6 0.6) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 9 smd roundrect (at 0 0) (size 2.4 3.2) (layers F.Cu F.Mask) (roundrect_rratio 0.0625))
(pad 9 smd rect (at 0 0) (size 2.4 3.2) (layers F.Cu F.Mask))
(pad "" smd roundrect (at -0.6 -0.8) (size 0.97 1.29) (layers F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at -0.6 0.8) (size 0.97 1.29) (layers F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at 0.6 -0.8) (size 0.97 1.29) (layers F.Paste) (roundrect_rratio 0.25))
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6 changes: 3 additions & 3 deletions Package_SO.pretty/HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.4x3.2mm_ThermalVias.kicad_mod
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Original file line number Diff line number Diff line change
@@ -1,4 +1,4 @@
(module HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.4x3.2mm_ThermalVias (layer F.Cu) (tedit 5D9F72AF)
(module HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.4x3.2mm_ThermalVias (layer F.Cu) (tedit 5DC5FE74)
(descr "HTSOP, 8 Pin (https://media.digikey.com/pdf/Data%20Sheets/Rohm%20PDFs/BD9G341EFJ.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py")
(tags "HTSOP SO")
(attr smd)
Expand Down Expand Up @@ -29,14 +29,14 @@
(pad 6 smd roundrect (at 2.65 0.635) (size 1.6 0.6) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 7 smd roundrect (at 2.65 -0.635) (size 1.6 0.6) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 8 smd roundrect (at 2.65 -1.905) (size 1.6 0.6) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 9 smd roundrect (at 0 0) (size 2.4 3.2) (layers F.Cu F.Mask) (roundrect_rratio 0.0625))
(pad 9 smd rect (at 0 0) (size 2.4 3.2) (layers F.Cu F.Mask))
(pad 9 thru_hole circle (at -0.95 -1.35) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 9 thru_hole circle (at 0.95 -1.35) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 9 thru_hole circle (at -0.95 0) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 9 thru_hole circle (at 0.95 0) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 9 thru_hole circle (at -0.95 1.35) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 9 thru_hole circle (at 0.95 1.35) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 9 smd roundrect (at 0 0) (size 2.4 3.2) (layers B.Cu) (roundrect_rratio 0.0625))
(pad 9 smd rect (at 0 0) (size 2.4 3.2) (layers B.Cu))
(pad "" smd roundrect (at -0.6 -0.8) (size 0.97 1.29) (layers F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at -0.6 0.8) (size 0.97 1.29) (layers F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at 0.6 -0.8) (size 0.97 1.29) (layers F.Paste) (roundrect_rratio 0.25))
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8 changes: 4 additions & 4 deletions ...e_SO.pretty/HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.46x2.31mm_ThermalVias.kicad_mod
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@@ -1,4 +1,4 @@
(module HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.46x2.31mm_ThermalVias (layer F.Cu) (tedit 5D9F72AF)
(module HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.46x2.31mm_ThermalVias (layer F.Cu) (tedit 5DC5FE74)
(descr "HTSSOP, 16 Pin (http://www.analog.com/media/en/technical-documentation/data-sheets/LTC7810.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py")
(tags "HTSSOP SO")
(attr smd)
Expand Down Expand Up @@ -37,15 +37,15 @@
(pad 14 smd roundrect (at 2.8625 -0.975) (size 1.575 0.4) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 15 smd roundrect (at 2.8625 -1.625) (size 1.575 0.4) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 16 smd roundrect (at 2.8625 -2.275) (size 1.575 0.4) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at 0 0) (size 2.46 2.31) (layers F.Mask) (roundrect_rratio 0.04329))
(pad 17 smd roundrect (at 0 0) (size 3.4 5) (layers F.Cu) (roundrect_rratio 0.029412))
(pad "" smd rect (at 0 0) (size 2.46 2.31) (layers F.Mask))
(pad 17 smd rect (at 0 0) (size 3.4 5) (layers F.Cu))
(pad 17 thru_hole circle (at -0.75 -1.5) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 17 thru_hole circle (at 0.75 -1.5) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 17 thru_hole circle (at -0.75 0) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 17 thru_hole circle (at 0.75 0) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 17 thru_hole circle (at -0.75 1.5) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 17 thru_hole circle (at 0.75 1.5) (size 0.5 0.5) (drill 0.2) (layers *.Cu))
(pad 17 smd roundrect (at 0 0) (size 2 3.5) (layers B.Cu) (roundrect_rratio 0.05))
(pad 17 smd rect (at 0 0) (size 2 3.5) (layers B.Cu))
(pad "" smd roundrect (at 0 -0.58) (size 1.98 0.93) (layers F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at 0 0.58) (size 1.98 0.93) (layers F.Paste) (roundrect_rratio 0.25))
(fp_text user %R (at 0 0) (layer F.Fab)
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4 changes: 2 additions & 2 deletions Package_SO.pretty/HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3x3mm.kicad_mod
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Original file line number Diff line number Diff line change
@@ -1,4 +1,4 @@
(module HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3x3mm (layer F.Cu) (tedit 5D9F72AF)
(module HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3x3mm (layer F.Cu) (tedit 5DC5FE74)
(descr "HTSSOP, 16 Pin (https://www.st.com/resource/en/datasheet/stp08cp05.pdf#page=20), generated with kicad-footprint-generator ipc_gullwing_generator.py")
(tags "HTSSOP SO")
(attr smd)
Expand Down Expand Up @@ -37,7 +37,7 @@
(pad 14 smd roundrect (at 2.875 -0.975) (size 1.55 0.4) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 15 smd roundrect (at 2.875 -1.625) (size 1.55 0.4) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 16 smd roundrect (at 2.875 -2.275) (size 1.55 0.4) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 17 smd roundrect (at 0 0) (size 3 3) (layers F.Cu F.Mask) (roundrect_rratio 0.033333))
(pad 17 smd rect (at 0 0) (size 3 3) (layers F.Cu F.Mask))
(pad "" smd roundrect (at -0.75 -0.75) (size 1.21 1.21) (layers F.Paste) (roundrect_rratio 0.206612))
(pad "" smd roundrect (at -0.75 0.75) (size 1.21 1.21) (layers F.Paste) (roundrect_rratio 0.206612))
(pad "" smd roundrect (at 0.75 -0.75) (size 1.21 1.21) (layers F.Paste) (roundrect_rratio 0.206612))
Expand Down
6 changes: 3 additions & 3 deletions Package_SO.pretty/HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_Mask2.4x3.7mm.kicad_mod
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Original file line number Diff line number Diff line change
@@ -1,4 +1,4 @@
(module HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_Mask2.4x3.7mm (layer F.Cu) (tedit 5D9F72AF)
(module HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_Mask2.4x3.7mm (layer F.Cu) (tedit 5DC5FE74)
(descr "HTSSOP, 20 Pin (http://www.ti.com/lit/ds/symlink/bq24006.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py")
(tags "HTSSOP SO")
(attr smd)
Expand Down Expand Up @@ -41,8 +41,8 @@
(pad 18 smd roundrect (at 2.8625 -1.625) (size 1.575 0.4) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 19 smd roundrect (at 2.8625 -2.275) (size 1.575 0.4) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 20 smd roundrect (at 2.8625 -2.925) (size 1.575 0.4) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at 0 0) (size 2.4 3.7) (layers F.Mask) (roundrect_rratio 0.041667))
(pad 21 smd roundrect (at 0 0) (size 3.4 6.5) (layers F.Cu) (roundrect_rratio 0.029412))
(pad "" smd rect (at 0 0) (size 2.4 3.7) (layers F.Mask))
(pad 21 smd rect (at 0 0) (size 3.4 6.5) (layers F.Cu))
(pad "" smd roundrect (at 0 -0.925) (size 1.93 1.49) (layers F.Paste) (roundrect_rratio 0.167785))
(pad "" smd roundrect (at 0 0.925) (size 1.93 1.49) (layers F.Paste) (roundrect_rratio 0.167785))
(fp_text user %R (at 0 0) (layer F.Fab)
Expand Down
6 changes: 3 additions & 3 deletions Package_SO.pretty/HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_Mask2.75x3.43mm.kicad_mod
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Original file line number Diff line number Diff line change
@@ -1,4 +1,4 @@
(module HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_Mask2.75x3.43mm (layer F.Cu) (tedit 5D9F72AF)
(module HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_Mask2.75x3.43mm (layer F.Cu) (tedit 5DC5FE74)
(descr "HTSSOP, 20 Pin (http://www.ti.com/lit/ds/symlink/tlc5971.pdf#page=37&zoom=160,-90,3), generated with kicad-footprint-generator ipc_gullwing_generator.py")
(tags "HTSSOP SO")
(attr smd)
Expand Down Expand Up @@ -41,8 +41,8 @@
(pad 18 smd roundrect (at 2.8625 -1.625) (size 1.575 0.4) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 19 smd roundrect (at 2.8625 -2.275) (size 1.575 0.4) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 20 smd roundrect (at 2.8625 -2.925) (size 1.575 0.4) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at 0 0) (size 2.75 3.43) (layers F.Mask) (roundrect_rratio 0.036364))
(pad 21 smd roundrect (at 0 0) (size 3.4 6.5) (layers F.Cu) (roundrect_rratio 0.029412))
(pad "" smd rect (at 0 0) (size 2.75 3.43) (layers F.Mask))
(pad 21 smd rect (at 0 0) (size 3.4 6.5) (layers F.Cu))
(pad "" smd roundrect (at -0.69 -0.86) (size 1.11 1.38) (layers F.Paste) (roundrect_rratio 0.225225))
(pad "" smd roundrect (at -0.69 0.86) (size 1.11 1.38) (layers F.Paste) (roundrect_rratio 0.225225))
(pad "" smd roundrect (at 0.69 -0.86) (size 1.11 1.38) (layers F.Paste) (roundrect_rratio 0.225225))
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8 changes: 4 additions & 4 deletions ....pretty/HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_Mask2.75x3.43mm_ThermalVias.kicad_mod
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Original file line number Diff line number Diff line change
@@ -1,4 +1,4 @@
(module HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_Mask2.75x3.43mm_ThermalVias (layer F.Cu) (tedit 5D9F72AF)
(module HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_Mask2.75x3.43mm_ThermalVias (layer F.Cu) (tedit 5DC5FE74)
(descr "HTSSOP, 20 Pin (http://www.ti.com/lit/ds/symlink/tlc5971.pdf#page=37&zoom=160,-90,3), generated with kicad-footprint-generator ipc_gullwing_generator.py")
(tags "HTSSOP SO")
(attr smd)
Expand Down Expand Up @@ -41,8 +41,8 @@
(pad 18 smd roundrect (at 2.8625 -1.625) (size 1.575 0.4) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 19 smd roundrect (at 2.8625 -2.275) (size 1.575 0.4) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 20 smd roundrect (at 2.8625 -2.925) (size 1.575 0.4) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at 0 0) (size 2.75 3.43) (layers F.Mask) (roundrect_rratio 0.036364))
(pad 21 smd roundrect (at 0 0) (size 3.4 6.5) (layers F.Cu) (roundrect_rratio 0.029412))
(pad "" smd rect (at 0 0) (size 2.75 3.43) (layers F.Mask))
(pad 21 smd rect (at 0 0) (size 3.4 6.5) (layers F.Cu))
(pad 21 thru_hole circle (at -1.3 -2.6) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
(pad 21 thru_hole circle (at 0 -2.6) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
(pad 21 thru_hole circle (at 1.3 -2.6) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
Expand All @@ -58,7 +58,7 @@
(pad 21 thru_hole circle (at -1.3 2.6) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
(pad 21 thru_hole circle (at 0 2.6) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
(pad 21 thru_hole circle (at 1.3 2.6) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
(pad 21 smd roundrect (at 0 0) (size 3.2 5.8) (layers B.Cu) (roundrect_rratio 0.03125))
(pad 21 smd rect (at 0 0) (size 3.2 5.8) (layers B.Cu))
(pad "" smd roundrect (at -0.69 -0.86) (size 1.11 1.38) (layers F.Paste) (roundrect_rratio 0.225225))
(pad "" smd roundrect (at -0.69 0.86) (size 1.11 1.38) (layers F.Paste) (roundrect_rratio 0.225225))
(pad "" smd roundrect (at 0.69 -0.86) (size 1.11 1.38) (layers F.Paste) (roundrect_rratio 0.225225))
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4 changes: 2 additions & 2 deletions Package_SO.pretty/HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.2x5mm.kicad_mod
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Original file line number Diff line number Diff line change
@@ -1,4 +1,4 @@
(module HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.2x5mm (layer F.Cu) (tedit 5D9F72AF)
(module HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.2x5mm (layer F.Cu) (tedit 5DC5FE74)
(descr "HTSSOP, 24 Pin (https://www.st.com/resource/en/datasheet/stp16cp05.pdf#page=25), generated with kicad-footprint-generator ipc_gullwing_generator.py")
(tags "HTSSOP SO")
(attr smd)
Expand Down Expand Up @@ -45,7 +45,7 @@
(pad 22 smd roundrect (at 2.875 -2.275) (size 1.55 0.4) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 23 smd roundrect (at 2.875 -2.925) (size 1.55 0.4) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 24 smd roundrect (at 2.875 -3.575) (size 1.55 0.4) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 25 smd roundrect (at 0 0) (size 3.2 5) (layers F.Cu F.Mask) (roundrect_rratio 0.03125))
(pad 25 smd rect (at 0 0) (size 3.2 5) (layers F.Cu F.Mask))
(pad "" smd roundrect (at -0.8 -1.67) (size 1.29 1.34) (layers F.Paste) (roundrect_rratio 0.193798))
(pad "" smd roundrect (at -0.8 0) (size 1.29 1.34) (layers F.Paste) (roundrect_rratio 0.193798))
(pad "" smd roundrect (at -0.8 1.67) (size 1.29 1.34) (layers F.Paste) (roundrect_rratio 0.193798))
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6 changes: 3 additions & 3 deletions Package_SO.pretty/HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x4.68mm.kicad_mod
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Original file line number Diff line number Diff line change
@@ -1,4 +1,4 @@
(module HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x4.68mm (layer F.Cu) (tedit 5D9F72AF)
(module HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x4.68mm (layer F.Cu) (tedit 5DC5FE74)
(descr "HTSSOP, 24 Pin (http://www.ti.com/lit/ds/symlink/tps703.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py")
(tags "HTSSOP SO")
(attr smd)
Expand Down Expand Up @@ -45,8 +45,8 @@
(pad 22 smd roundrect (at 2.8625 -2.275) (size 1.575 0.4) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 23 smd roundrect (at 2.8625 -2.925) (size 1.575 0.4) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 24 smd roundrect (at 2.8625 -3.575) (size 1.575 0.4) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at 0 0) (size 2.4 4.68) (layers F.Mask) (roundrect_rratio 0.041667))
(pad 25 smd roundrect (at 0 0) (size 3.4 7.8) (layers F.Cu) (roundrect_rratio 0.029412))
(pad "" smd rect (at 0 0) (size 2.4 4.68) (layers F.Mask))
(pad 25 smd rect (at 0 0) (size 3.4 7.8) (layers F.Cu))
(pad "" smd roundrect (at 0 -1.17) (size 1.93 1.89) (layers F.Paste) (roundrect_rratio 0.132275))
(pad "" smd roundrect (at 0 1.17) (size 1.93 1.89) (layers F.Paste) (roundrect_rratio 0.132275))
(fp_text user %R (at 0 0) (layer F.Fab)
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8 changes: 4 additions & 4 deletions ...O.pretty/HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x4.68mm_ThermalVias.kicad_mod
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Original file line number Diff line number Diff line change
@@ -1,4 +1,4 @@
(module HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x4.68mm_ThermalVias (layer F.Cu) (tedit 5D9F72AF)
(module HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x4.68mm_ThermalVias (layer F.Cu) (tedit 5DC5FE74)
(descr "HTSSOP, 24 Pin (http://www.ti.com/lit/ds/symlink/tps703.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py")
(tags "HTSSOP SO")
(attr smd)
Expand Down Expand Up @@ -45,8 +45,8 @@
(pad 22 smd roundrect (at 2.8625 -2.275) (size 1.575 0.4) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 23 smd roundrect (at 2.8625 -2.925) (size 1.575 0.4) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 24 smd roundrect (at 2.8625 -3.575) (size 1.575 0.4) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad "" smd roundrect (at 0 0) (size 2.4 4.68) (layers F.Mask) (roundrect_rratio 0.041667))
(pad 25 smd roundrect (at 0 0) (size 3.4 7.8) (layers F.Cu) (roundrect_rratio 0.029412))
(pad "" smd rect (at 0 0) (size 2.4 4.68) (layers F.Mask))
(pad 25 smd rect (at 0 0) (size 3.4 7.8) (layers F.Cu))
(pad 25 thru_hole circle (at -1.3 -3.25) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
(pad 25 thru_hole circle (at 0 -3.25) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
(pad 25 thru_hole circle (at 1.3 -3.25) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
Expand All @@ -65,7 +65,7 @@
(pad 25 thru_hole circle (at -1.3 3.25) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
(pad 25 thru_hole circle (at 0 3.25) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
(pad 25 thru_hole circle (at 1.3 3.25) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
(pad 25 smd roundrect (at 0 0) (size 3.2 7.1) (layers B.Cu) (roundrect_rratio 0.03125))
(pad 25 smd rect (at 0 0) (size 3.2 7.1) (layers B.Cu))
(pad "" smd roundrect (at 0 -1.17) (size 1.93 1.89) (layers F.Paste) (roundrect_rratio 0.132275))
(pad "" smd roundrect (at 0 1.17) (size 1.93 1.89) (layers F.Paste) (roundrect_rratio 0.132275))
(fp_text user %R (at 0 0) (layer F.Fab)
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4 changes: 2 additions & 2 deletions Package_SO.pretty/HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.85x5.4mm.kicad_mod
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Original file line number Diff line number Diff line change
@@ -1,4 +1,4 @@
(module HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.85x5.4mm (layer F.Cu) (tedit 5D9F72AF)
(module HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.85x5.4mm (layer F.Cu) (tedit 5DC5FE74)
(descr "HTSSOP, 28 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0108.PDF), generated with kicad-footprint-generator ipc_gullwing_generator.py")
(tags "HTSSOP SO")
(attr smd)
Expand Down Expand Up @@ -54,7 +54,7 @@
(pad 26 smd roundrect (at 2.8625 -2.925) (size 1.475 0.4) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 27 smd roundrect (at 2.8625 -3.575) (size 1.475 0.4) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 28 smd roundrect (at 2.8625 -4.225) (size 1.475 0.4) (layers F.Cu F.Mask F.Paste) (roundrect_rratio 0.25))
(pad 29 smd roundrect (at 0 0) (size 2.85 5.4) (layers F.Cu F.Mask) (roundrect_rratio 0.035088))
(pad 29 smd rect (at 0 0) (size 2.85 5.4) (layers F.Cu F.Mask))
(pad "" smd roundrect (at 0 0) (size 2.3 4.35) (layers F.Paste) (roundrect_rratio 0.108696))
(fp_text user %R (at 0 0) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
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