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Merge pull request #9 from SchrodingersGat/master
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Added TSSOP-44 package
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CarlPoirier committed Nov 29, 2015
2 parents 9b3ca72 + d6ae0e0 commit 10e9433
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43 changes: 43 additions & 0 deletions MSOP-16(12)-1EP-VIA_3x4mm_Pitch0.5mm.kicad_mod
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(module "MSOP-16(12)-1EP-VIA_3x4mm_Pitch0.5mm" (layer F.Cu) (tedit 5631AC3D)
(descr "10-Lead Plastic Micro Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SSOP 0.5")
(attr smd)
(fp_text reference REF** (at 0 -3.35) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value "MSOP-16(12)-1EP-VIA_3x4mm_Pitch0.5mm" (at 0 3.5) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -3.15 -2.6) (end -3.15 2.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.15 -2.6) (end 3.15 2.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.15 -2.6) (end 3.15 -2.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.15 2.6) (end 3.15 2.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.675 -2.425) (end -1.675 -2.125) (layer F.SilkS) (width 0.15))
(fp_line (start 1.675 -2.425) (end 1.675 -2.125) (layer F.SilkS) (width 0.15))
(fp_line (start 1.675 2.425) (end 1.675 2.125) (layer F.SilkS) (width 0.15))
(fp_line (start -1.675 2.425) (end -1.675 2.125) (layer F.SilkS) (width 0.15))
(fp_line (start -1.675 -2.425) (end 1.675 -2.425) (layer F.SilkS) (width 0.15))
(fp_line (start -1.675 2.425) (end 1.675 2.425) (layer F.SilkS) (width 0.15))
(fp_line (start -1.675 -2.125) (end -2.9 -2.125) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -2.2 -1.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at -2.2 -0.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at -2.2 0.25) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 12 smd rect (at 2.2 0.25) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 14 smd rect (at 2.2 -0.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 16 smd rect (at 2.2 -1.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at -2.2 0.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 7 smd rect (at -2.2 1.25) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 8 smd rect (at -2.2 1.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 11 smd rect (at 2.2 0.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 10 smd rect (at 2.2 1.25) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 9 smd rect (at 2.2 1.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 17 smd rect (at 0 0) (size 1.65 2.85) (layers F.Cu F.Paste F.Mask))
(pad 17 thru_hole circle (at 0 0) (size 0.65 0.65) (drill 0.25) (layers *.Cu *.Paste *.Mask))
(pad 17 thru_hole circle (at 0 1) (size 0.65 0.65) (drill 0.25) (layers *.Cu *.Paste *.Mask))
(pad 17 thru_hole circle (at 0 -1) (size 0.65 0.65) (drill 0.25) (layers *.Cu *.Paste *.Mask))
(model "Housings_SSOP.3dshapes/MSOP-16(12)_3x4mm_Pitch0.5mm.wrl"
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
40 changes: 40 additions & 0 deletions MSOP-16(12)-1EP_3x4mm_Pitch0.5mm.kicad_mod
Original file line number Diff line number Diff line change
@@ -0,0 +1,40 @@
(module "MSOP-16(12)-1EP_3x4mm_Pitch0.5mm" (layer F.Cu) (tedit 5653DFF3)
(descr "10-Lead Plastic Micro Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SSOP 0.5")
(attr smd)
(fp_text reference REF** (at 0 -3.35) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value "MSOP-16(12)-1EP_3x4mm_Pitch0.5mm" (at 0 3.5) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -3.15 -2.6) (end -3.15 2.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.15 -2.6) (end 3.15 2.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.15 -2.6) (end 3.15 -2.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.15 2.6) (end 3.15 2.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.675 -2.425) (end -1.675 -2.125) (layer F.SilkS) (width 0.15))
(fp_line (start 1.675 -2.425) (end 1.675 -2.125) (layer F.SilkS) (width 0.15))
(fp_line (start 1.675 2.425) (end 1.675 2.125) (layer F.SilkS) (width 0.15))
(fp_line (start -1.675 2.425) (end -1.675 2.125) (layer F.SilkS) (width 0.15))
(fp_line (start -1.675 -2.425) (end 1.675 -2.425) (layer F.SilkS) (width 0.15))
(fp_line (start -1.675 2.425) (end 1.675 2.425) (layer F.SilkS) (width 0.15))
(fp_line (start -1.675 -2.125) (end -2.9 -2.125) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -2.2 -1.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at -2.2 -0.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at -2.2 0.25) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 12 smd rect (at 2.2 0.25) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 14 smd rect (at 2.2 -0.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 16 smd rect (at 2.2 -1.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at -2.2 0.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 7 smd rect (at -2.2 1.25) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 8 smd rect (at -2.2 1.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 11 smd rect (at 2.2 0.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 10 smd rect (at 2.2 1.25) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 9 smd rect (at 2.2 1.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 17 smd rect (at 0 -0.1) (size 1.65 2.85) (layers F.Cu F.Paste F.Mask))
(model "Housings_SSOP.3dshapes/MSOP-16(12)_3x4mm_Pitch0.5mm.wrl"
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
39 changes: 39 additions & 0 deletions MSOP-16(12)_3x4mm_Pitch0.5mm.kicad_mod
Original file line number Diff line number Diff line change
@@ -0,0 +1,39 @@
(module "MSOP-16(12)_3x4mm_Pitch0.5mm" (layer F.Cu) (tedit 562DC17E)
(descr "10-Lead Plastic Micro Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SSOP 0.5")
(attr smd)
(fp_text reference REF** (at 0 -3.35) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value "MSOP-16(12)_3x4mm_Pitch0.5mm" (at 0 3.5) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -3.15 -2.6) (end -3.15 2.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.15 -2.6) (end 3.15 2.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.15 -2.6) (end 3.15 -2.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.15 2.6) (end 3.15 2.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.675 -2.425) (end -1.675 -2.125) (layer F.SilkS) (width 0.15))
(fp_line (start 1.675 -2.425) (end 1.675 -2.125) (layer F.SilkS) (width 0.15))
(fp_line (start 1.675 2.425) (end 1.675 2.125) (layer F.SilkS) (width 0.15))
(fp_line (start -1.675 2.425) (end -1.675 2.125) (layer F.SilkS) (width 0.15))
(fp_line (start -1.675 -2.425) (end 1.675 -2.425) (layer F.SilkS) (width 0.15))
(fp_line (start -1.675 2.425) (end 1.675 2.425) (layer F.SilkS) (width 0.15))
(fp_line (start -1.675 -2.125) (end -2.9 -2.125) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -2.2 -1.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at -2.2 -0.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at -2.2 0.25) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 12 smd rect (at 2.2 0.25) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 14 smd rect (at 2.2 -0.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 16 smd rect (at 2.2 -1.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at -2.2 0.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 7 smd rect (at -2.2 1.25) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 8 smd rect (at -2.2 1.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 11 smd rect (at 2.2 0.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 10 smd rect (at 2.2 1.25) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 9 smd rect (at 2.2 1.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(model "Housings_SSOP.3dshapes/MSOP-16(12)_3x4mm_Pitch0.5mm.wrl"
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
47 changes: 47 additions & 0 deletions MSOP-16-1EP-VIA_3x4mm_Pitch0.5mm.kicad_mod
Original file line number Diff line number Diff line change
@@ -0,0 +1,47 @@
(module MSOP-16-1EP-VIA_3x4mm_Pitch0.5mm (layer F.Cu) (tedit 5653E028)
(descr "10-Lead Plastic Micro Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SSOP 0.5")
(attr smd)
(fp_text reference REF** (at 0 -3.35) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value MSOP-16-1EP_3x4mm_Pitch0.5mm (at 0 3.5) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -3.15 -2.6) (end -3.15 2.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.15 -2.6) (end 3.15 2.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.15 -2.6) (end 3.15 -2.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.15 2.6) (end 3.15 2.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.675 -2.425) (end -1.675 -2.125) (layer F.SilkS) (width 0.15))
(fp_line (start 1.675 -2.425) (end 1.675 -2.125) (layer F.SilkS) (width 0.15))
(fp_line (start 1.675 2.425) (end 1.675 2.125) (layer F.SilkS) (width 0.15))
(fp_line (start -1.675 2.425) (end -1.675 2.125) (layer F.SilkS) (width 0.15))
(fp_line (start -1.675 -2.425) (end 1.675 -2.425) (layer F.SilkS) (width 0.15))
(fp_line (start -1.675 2.425) (end 1.675 2.425) (layer F.SilkS) (width 0.15))
(fp_line (start -1.675 -2.125) (end -2.9 -2.125) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -2.2 -1.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at -2.2 -1.25) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at -2.2 -0.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 4 smd rect (at -2.2 -0.25) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at -2.2 0.25) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 12 smd rect (at 2.2 0.25) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 13 smd rect (at 2.2 -0.25) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 14 smd rect (at 2.2 -0.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 15 smd rect (at 2.2 -1.25) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 16 smd rect (at 2.2 -1.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at -2.2 0.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 7 smd rect (at -2.2 1.25) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 8 smd rect (at -2.2 1.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 11 smd rect (at 2.2 0.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 10 smd rect (at 2.2 1.25) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 9 smd rect (at 2.2 1.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 17 smd rect (at 0 0) (size 1.65 2.85) (layers F.Cu F.Paste F.Mask))
(pad 17 thru_hole circle (at 0 0) (size 0.65 0.65) (drill 0.25) (layers *.Cu *.Paste *.Mask))
(pad 17 thru_hole circle (at 0 1) (size 0.65 0.65) (drill 0.25) (layers *.Cu *.Paste *.Mask))
(pad 17 thru_hole circle (at 0 -1) (size 0.65 0.65) (drill 0.25) (layers *.Cu *.Paste *.Mask))
(model Housings_SSOP.3dshapes/MSOP-16_3x4mm_Pitch0.5mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
44 changes: 44 additions & 0 deletions MSOP-16-1EP_3x4mm_Pitch0.5mm.kicad_mod
Original file line number Diff line number Diff line change
@@ -0,0 +1,44 @@
(module MSOP-16-1EP_3x4mm_Pitch0.5mm (layer F.Cu) (tedit 562DC247)
(descr "10-Lead Plastic Micro Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SSOP 0.5")
(attr smd)
(fp_text reference REF** (at 0 -3.35) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value MSOP-16-1EP_3x4mm_Pitch0.5mm (at 0 3.5) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -3.15 -2.6) (end -3.15 2.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.15 -2.6) (end 3.15 2.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.15 -2.6) (end 3.15 -2.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.15 2.6) (end 3.15 2.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.675 -2.425) (end -1.675 -2.125) (layer F.SilkS) (width 0.15))
(fp_line (start 1.675 -2.425) (end 1.675 -2.125) (layer F.SilkS) (width 0.15))
(fp_line (start 1.675 2.425) (end 1.675 2.125) (layer F.SilkS) (width 0.15))
(fp_line (start -1.675 2.425) (end -1.675 2.125) (layer F.SilkS) (width 0.15))
(fp_line (start -1.675 -2.425) (end 1.675 -2.425) (layer F.SilkS) (width 0.15))
(fp_line (start -1.675 2.425) (end 1.675 2.425) (layer F.SilkS) (width 0.15))
(fp_line (start -1.675 -2.125) (end -2.9 -2.125) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -2.2 -1.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at -2.2 -1.25) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at -2.2 -0.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 4 smd rect (at -2.2 -0.25) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at -2.2 0.25) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 12 smd rect (at 2.2 0.25) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 13 smd rect (at 2.2 -0.25) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 14 smd rect (at 2.2 -0.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 15 smd rect (at 2.2 -1.25) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 16 smd rect (at 2.2 -1.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at -2.2 0.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 7 smd rect (at -2.2 1.25) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 8 smd rect (at -2.2 1.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 11 smd rect (at 2.2 0.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 10 smd rect (at 2.2 1.25) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 9 smd rect (at 2.2 1.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 17 smd rect (at 0 -0.1) (size 1.65 2.85) (layers F.Cu F.Paste F.Mask))
(model Housings_SSOP.3dshapes/MSOP-16_3x4mm_Pitch0.5mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
43 changes: 43 additions & 0 deletions MSOP-16_3x4mm_Pitch0.5mm.kicad_mod
Original file line number Diff line number Diff line change
@@ -0,0 +1,43 @@
(module MSOP-16_3x4mm_Pitch0.5mm (layer F.Cu) (tedit 562DC271)
(descr "10-Lead Plastic Micro Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SSOP 0.5")
(attr smd)
(fp_text reference REF** (at 0 -3.35) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value MSOP-16_3x4mm_Pitch0.5mm (at 0 3.5) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -3.15 -2.6) (end -3.15 2.6) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.15 -2.6) (end 3.15 2.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.15 -2.6) (end 3.15 -2.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.15 2.6) (end 3.15 2.6) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.675 -2.425) (end -1.675 -2.125) (layer F.SilkS) (width 0.15))
(fp_line (start 1.675 -2.425) (end 1.675 -2.125) (layer F.SilkS) (width 0.15))
(fp_line (start 1.675 2.425) (end 1.675 2.125) (layer F.SilkS) (width 0.15))
(fp_line (start -1.675 2.425) (end -1.675 2.125) (layer F.SilkS) (width 0.15))
(fp_line (start -1.675 -2.425) (end 1.675 -2.425) (layer F.SilkS) (width 0.15))
(fp_line (start -1.675 2.425) (end 1.675 2.425) (layer F.SilkS) (width 0.15))
(fp_line (start -1.675 -2.125) (end -2.9 -2.125) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -2.2 -1.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at -2.2 -1.25) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at -2.2 -0.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 4 smd rect (at -2.2 -0.25) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at -2.2 0.25) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 12 smd rect (at 2.2 0.25) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 13 smd rect (at 2.2 -0.25) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 14 smd rect (at 2.2 -0.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 15 smd rect (at 2.2 -1.25) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 16 smd rect (at 2.2 -1.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at -2.2 0.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 7 smd rect (at -2.2 1.25) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at -2.2 1.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 11 smd rect (at 2.2 0.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 10 smd rect (at 2.2 1.25) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(pad 9 smd rect (at 2.2 1.75) (size 1.4 0.3) (layers F.Cu F.Paste F.Mask))
(model Housings_SSOP.3dshapes/MSOP-16_3x4mm_Pitch0.5mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
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