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Bmulder/electronics rebased #25

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merged 57 commits into from
Jul 11, 2024
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To get out some additional byproducts (e.g. Ga, Sc)
* Azo dyes
* Anthroquinone dyes
* Sulfur Black
* Indigo
Added oxidized wafers
added wafer textures
Added photomasks
* Redid oxide layer, added wafer cleaning, added NF3 plasma etching
* Added gold cyanidation + electroplating
* added Al PVD
* Added Ru Electroplating for CMOS interconnects
* Added metal etching for interconnects
* Added some die textures
* flip over wafer IDs
* Added bonding/packaging of dies
* Added recipes for e.g. SMD components
* Added photomask crafting using maskless lithography
* Added solder paste & resin
* loop over MTEs if tiers are equivalent
* some other fixes
produced using MOVPE
Moved some recipes (PVD, CVD, sputtering) to Vacuum Deposition
* Wafers now have the according material content to show the steps
* TFTs now use a more realistic process
* Fixed Glycerol bug
Removed old solar panel recipes
@BorisMulder BorisMulder merged commit 9c2bde3 into master Jul 11, 2024
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@BorisMulder BorisMulder linked an issue Jul 14, 2024 that may be closed by this pull request
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Electronics
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