Cutting Chips
We use wafers that are slightly more conductive than typical phosphorous doped silicon, specifically antimony (Sb) doped wafers. The full parameters of our typical chips are:
Diameter: 100 +/-0.5 mm
Type/Orientation: N/Antimony<111>
Resistivity:0.005-0.02 ohm*m
Thickness: 500-550 um
Specifications: SSP, 1 flat
These wafers are: N-type silicon; Antimony doped; <111> crystal orientation; low resistivity; ~0.5 mm thick (high tolerance here is not that important); single side polished (SSP, double side polished or DSP wafers are unnecessary); single flat (a flat is a straight line (chord) on one side of the wafer that helps with alignment).
Wafers can be purchased from WRS Materials (our usual supplier, now PureWafer), Ultrasil, or other suppliers.
Chips that cross the edge of the wafer are (obviously) waste.
You can get 8 35x16 mm chips from a 100mm wafer.