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SSOP-16_3.9x4.9mm_Pitch0.635mm.kicad_mod
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SSOP-16_3.9x4.9mm_Pitch0.635mm.kicad_mod
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(module SSOP-16_3.9x4.9mm_Pitch0.635mm (layer F.Cu) (tedit 54130A77)
(descr "SSOP16: plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot519-1_po.pdf)")
(tags "SSOP 0.635")
(attr smd)
(fp_text reference REF** (at 0 -3.5) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value SSOP-16_3.9x4.9mm_Pitch0.635mm (at 0 3.5) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -0.95 -2.45) (end 1.95 -2.45) (layer F.Fab) (width 0.15))
(fp_line (start 1.95 -2.45) (end 1.95 2.45) (layer F.Fab) (width 0.15))
(fp_line (start 1.95 2.45) (end -1.95 2.45) (layer F.Fab) (width 0.15))
(fp_line (start -1.95 2.45) (end -1.95 -1.45) (layer F.Fab) (width 0.15))
(fp_line (start -1.95 -1.45) (end -0.95 -2.45) (layer F.Fab) (width 0.15))
(fp_line (start -3.45 -2.85) (end -3.45 2.8) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.45 -2.85) (end 3.45 2.8) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.45 -2.85) (end 3.45 -2.85) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.45 2.8) (end 3.45 2.8) (layer F.CrtYd) (width 0.05))
(fp_line (start -2 2.675) (end 2 2.675) (layer F.SilkS) (width 0.15))
(fp_line (start -3.275 -2.725) (end 2 -2.725) (layer F.SilkS) (width 0.15))
(fp_text user %R (at 0 0) (layer F.Fab)
(effects (font (size 0.8 0.8) (thickness 0.15)))
)
(pad 1 smd rect (at -2.6 -2.2225) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at -2.6 -1.5875) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at -2.6 -0.9525) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
(pad 4 smd rect (at -2.6 -0.3175) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at -2.6 0.3175) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at -2.6 0.9525) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
(pad 7 smd rect (at -2.6 1.5875) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
(pad 8 smd rect (at -2.6 2.2225) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
(pad 9 smd rect (at 2.6 2.2225) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
(pad 10 smd rect (at 2.6 1.5875) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
(pad 11 smd rect (at 2.6 0.9525) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
(pad 12 smd rect (at 2.6 0.3175) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
(pad 13 smd rect (at 2.6 -0.3175) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
(pad 14 smd rect (at 2.6 -0.9525) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
(pad 15 smd rect (at 2.6 -1.5875) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
(pad 16 smd rect (at 2.6 -2.2225) (size 1.2 0.4) (layers F.Cu F.Paste F.Mask))
(model ${KISYS3DMOD}/Housings_SSOP.3dshapes/SSOP-16_3.9x4.9mm_Pitch0.635mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)